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The purpose of this study was to compare the tensile bond strength of the resin-metal interface between etched only and etched & goldplated metal specimens. Etched only and etched & goldplated metal specimens were treated or were not treated with bonding agent and bonded to metal specimens with Comspan and MBAS. Also, electrochemically only etched metal surface and etched & goldplated metal surface was observed by SEM. The following results were obtained: 1. The tensile bond strength of the electrochemically etched only and gold-plated specimens were not significantly different in Comspan group, but the gold-plated specimens in MBAS group demonstrated slightly lower values than the etched only specimens. 2. The tensile bond strengths were not significantly different between the treated group with bonding agent and not-treated group with bonding agent. 3. The tensile bond strengths were not significantly different between the Comspan and MBAS groups. 4. The basic microretentive structures, maintained obviously in the etched and goldplated metal surfaces by SEM.
K O Park, and
D H Han
February 1988,
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K O Park, and
D H Han
October 1987,
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K O Park, and
D H Han
February 1985,
The Journal of prosthetic dentistry,
K O Park, and
D H Han
February 1996,
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K O Park, and
D H Han
January 1983,
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K O Park, and
D H Han
September 1984,
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K O Park, and
D H Han
January 2000,
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K O Park, and
D H Han
May 1990,
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K O Park, and
D H Han
September 1986,
The Journal of prosthetic dentistry,
K O Park, and
D H Han
March 1986,
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