The objective of this study was to evaluate the use of pyruvic acid as an alternative etching agent to phosphoric acid (H3PO4). Solutions containing 5, 10, 15, 20, 25, and 30 m/m % pyruvic acid and 50% m/m H3PO4 were prepared. The tensile bond strengths of a composite resin to enamel surfaces etched with the respective etching agents were determined. The rates of etching of enamel surfaces by each of the etching solutions were evaluated. Unground and polished enamel surfaces were etched with the respective etching solutions and the surfaces examined by scanning electron microscopy. The tensile bond strengths of the resin to enamel surfaces etched with 10-30% pyruvic acid exceeded those obtained on enamel surfaces etched with 50% H3PO4. The rates of etching of all the pyruvic acid solutions were significantly less than of H3PO4. Well-defined etching patterns were observed on the enamel surfaces etched with all the etching solutions. The results of this laboratory study suggest that pyruvic acid may be a suitable alternative to phosphoric acid as an etching agent in clinical dentistry.