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In recent years alloys with a high copper content were developed to improve the corrosion resistance of dental amalgam by elimination of the gamma 2 (Sn-Hg) phase. The purpose of the present investigation was to compare the electrochemical behaviour of high copper amalgams obtained from single composition amalgam alloys (Indiloy; Shofu, Dental Corp., Menlo Park, USA) with those that used the additive mode of copper alloying (Dispersalloy; Johnson & Johnson, East Windsor, USA).
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