Thin Film Passivation Properties of Using Atomic Layer Deposition in Organic Light-Emitting Diodes. 2015

Dong-Eun Kim, and Hoon-Kyu Shin

In this paper, a thin film passivation for a gas barrier is performed using Al2O3. The passivation film shows a thickness of 50 nm. We deposit an Al2O3 layer using ALD. This material is used to protect devices from external oxygen as a barrier thin film. After this material is deposited, we measure IVL and its lifetime. The lifetime is increased to 15 times compared to that of OLED, which is non-passivated. We expect that as using this material the lifetime and luminance of OLED are to be increased. We hope that this article should be the basis for developing OLED.

UI MeSH Term Description Entries

Related Publications

Dong-Eun Kim, and Hoon-Kyu Shin
November 2009, Advanced materials (Deerfield Beach, Fla.),
Dong-Eun Kim, and Hoon-Kyu Shin
January 2015, Nanotechnology,
Dong-Eun Kim, and Hoon-Kyu Shin
January 2012, Nanoscale research letters,
Dong-Eun Kim, and Hoon-Kyu Shin
October 2020, ACS nano,
Copied contents to your clipboard!